cystech electronics corp. spec. no. : c614j3 issued date : 2008.07.11 revised date : page no. : 1/6 BTD7520J3 cystek product specification high voltage npn epitaxial planar transistor BTD7520J3 features ? high bv ceo ? very high current gain ? pb-free package symbol outline BTD7520J3 to-252 b c e b base c collector e emitter absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo 150 v collector-emitter voltage v ceo 150 v emitter-base voltage v ebo 6 v collector current (dc) i c 10 collector current (pulse) i cp 20 (note 1) a power dissipation @ t a =25 p d 1.75 (note 2) power dissipation @ t c =25 p d 20 w thermal resistance, junction to ambient r ja 71.4 (note 2) c/w thermal resistance, junction to case r jc 3.125 c/w junction temperature tj 150 c storage temperature tstg -55~+150 c note : 1. single pulse , pw Q 380 s,duty Q 2%. 2. when mounted on a pcb with the minimum pad size.
cystech electronics corp. spec. no. : c614j3 issued date : 2008.07.11 revised date : page no. : 2/6 BTD7520J3 cystek product specification characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo 150 - - v i c =1ma, i e =0 bv ceo 150 - - v i c =10ma, i b =0 bv ebo 6 - - v i c =100 a, i c =0 i cbo - - 10 a v cb =150v, i e =0 i ebo - - 10 a v eb =6v, i c =0 *v ce(sat) - - 2.5 v i c =5a, i b =50ma *v be(sat) - - 1.2 v i c =5a, i b =10ma *h fe 800 - - - v ce =5v, i c =1a *h fe 200 - - - v ce =5v, i c =5a cob - 130 - pf v cb =10v, f=1mhz *pulse test : pulse width 380 s, duty cycle 2% ordering information device package shipping marking BTD7520J3 to-252 (pb-free) 2500 pcs / tape & reel d7520
cystech electronics corp. spec. no. : c614j3 issued date : 2008.07.11 revised date : page no. : 3/6 BTD7520J3 cystek product specification characteristic curves current gain vs collector current 10 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) current gain---hfe vce=10 v vce=5v saturation voltage vs collector current 10 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) ic=100i ic=20ib ic=50ib vcesat saturation voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) vbe(sat) ic=60ib ic=10ib power derating curve 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 0 50 100 150 200 ambient temperature---ta() power dissipation---pd(w) power derating curve 0 5 10 15 20 25 0 50 100 150 200 case temperature---tc() power dissipation---pd(w)
cystech electronics corp. spec. no. : c614j3 issued date : 2008.07.11 revised date : page no. : 4/6 BTD7520J3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c614j3 issued date : 2008.07.11 revised date : page no. : 5/6 BTD7520J3 cystek product specification recommended wave soldering condition soldering time product peak temperature pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of the package, measured on the package body surface.
cystech electronics corp. spec. no. : c614j3 issued date : 2008.07.11 revised date : page no. : 6/6 BTD7520J3 cystek product specification to-252 dimension *: typical b a c e h i j k 3 2 1 d f g l d7520 marking: style: pin 1.base 2.collector 3.emitter 3-lead to-252 plastic surface mount package cystek package code: j3 inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0177 0.0217 0.45 0.55 g 0.0866 0.1102 2.20 2.80 b 0.0650 0.0768 1.65 1.95 h - *0.0906 - *2.30 c 0.0354 0.0591 0.90 1.50 i - 0.0354 - 0.90 d 0.0177 0.0236 0.45 0.60 j - 0.0315 - 0.80 e 0.2520 0.2677 6.40 6.80 k 0.2047 0.2165 5.20 5.50 f 0.2125 0.2283 5.40 5.80 l 0.0551 0.0630 1.40 1.60 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material: ? lead: kfc; solder plating ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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